电子设备热仿真建模方法研究

Research on Thermal Simulation Modeling Method of Electronic Equipment

摘要:

针对复杂电子设备在热仿真过程中由于建模不准确造成的计算成本高和仿真结果偏差大等问题,对芯片、电路板及电子单机等不同层级的电子产品的等效建模方法进行了研究,并利用Icepak软件进行了热仿真分析。仿真结果表明,芯片双热阻模型仿真精度较高,可用于板级及系统级热分析;电路板布线层信息对热仿真结果影响较大;集总参数法应用于孤立组件热分析时误差较大,适用于内部器件缺失的系统级热分析。研究结果为电子设备的热仿真分析提供了参考。

Abstract:

Aiming at the problems of high calculation cost and large deviation betweenexperiment results and simulation results caused by inaccurate modeling in thermasimulation of complex electronic devices, the equivalent modeling methods of different levelsof electronic products such as chip, circuit board and electronic equipment are studied, Icepaksoftware is used for thermal simulation, Simulation results show that the double thermaresistance model of chip has high calculation accuracy and can be used for board-level andsystem-level thermal analysis, the wiring layer information has significant influence on thethermal simulation results of the circuit board, lumped parameter method leads to a largeerror when applied to thermal simulation of isolated components and is suitable for thesystem-level thermal analysis with missing information of internal components. The researchresults provide a reference for the thermal simulation analysis of electronic equipment,