SiBON陶瓷高温性能研究

Study on High Temperature Properties of SiBON Ceramics

摘要:

针对硅硼氧氮(SiBON)陶瓷高温性能数据较少的问题，对SiBON陶瓷的高温力学、热学和电学性能进行了较全面的研究。研究结果表明，SiBON陶瓷高温时的弯曲强度明显高于室温时的，900 ℃时的弯曲强度为(190.1±12.1) MPa，较室温时的提升了82.9%。热膨胀系数在室温至1 000 ℃范围内的波动极小，1 000 ℃时的热膨胀系数为1.09×10-6/K。当热流密度为6.61 MW/m2时，线烧蚀率为2.47 μm/s。在测试频率范围内，1 000 ℃时的介电常数为3.26~3.31，损耗角正切值为3.92×10-3~6.00×10-3

Abstract:

In response to the problem of less data on the high temperature properties of SiBON ceramics, more comprehensive study on high temperature mechanical, thermal and electrical properties of SiBON ceramics was presented. The results show that the bending strength of SiBON ceramics at high temperature is significantly higher than that at room temperature. The bending strength is (190.1±12.1) MPa at 900 ℃, which is 82.9% higher than that at room temperature. The thermal expansion coefficient fluctuates very little in the interval from room temperature to 1 000 ℃, and is 1.09×106/K at 1 000 ℃. The line ablation rate is 2.47 μm/s at a heat flux of 6.61 MW/m2. In the test frequency range, the dielectric constant is 3.26~3.31 at 1 000 ℃, and the loss tangent is 3.92×10-3~6.00×10-3 at 1 000 ℃.